Publications

Journal Publications

(#: equal contribution *: corresponding author)

2022

16. Shicheng Zhou, Chenxi Wang*, Hui Fang, Daoyuan Li, Yu Du, Xiaoyun Qi "Electrospun Nanoparticles-loading Hollow MnOX Fibers with High Porosity for Formaldehyde Removal at Room Temperature" Journal of the Electrochemical Society. 169. 027518 link

15. Xiaoyun Qi#, Shicheng Zhou#, Hui Fang, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang* "One-step PDA Coating Strategy on Pure Zn for Blood-contacting Engineering" "One-step PDA coating strategy on pure Zn for blood-contacting engineering" Journal of Materials Science & Technology. 123, 1, 78-91 link

14. Hui Fang, Shicheng Zhou, Xiaoyun Qi, Yanhong Tian, Chenxi Wang* "Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications" Advanced Materials Interfaces. (Accepted) link

13. Hui Fang, Xiaoyun Qi, Shicheng Zhou, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang* "High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic- co -glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent Applications" ACS Applied Materials & Interfaces. 14, 2, 3536–3550 link

2021

12. Hui Fang, Shicheng Zhou, Xiaoyun Qi, Chenxi Wang*, Yanhong Tian "A Multifunctional Osteogenic System of Ultrasonically Spray Deposited Bone-active Coatings on Plasma-Activated Magnesium" Journal of Magnesium and Alloys. (In Press) link

11. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Ge Li, Tian Lu, Yanhong Tian, Peng He "Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture" ACS Applied Materials & Interfaces.13, 32, 38866–38876. link

10. Hui Fang, Chenxi Wang*, Daoyuan Li, Shicheng Zhou, Yu Du "Fabrication of Ag@Ag2O-MnOx Composite Nanowires for High-efficient Room-temperature Removal of Formaldehyde" Journal of Materials Science & Technology. 91, 5-16. link

2020

9. Hui Fang, Chenxi Wang*, Shicheng Zhou, Ge, Li, Yanhong Tian, Suga Tadatomo "Exploration of the Enhanced Performance for Silk Fibroin/sodium Alginate Composite Coatings on Biodegradable Mg-Zn-Ca Alloy" Journal of Magnesium and Alloys. 9(5). link

8. Shicheng Zhou, Xiaoyun Qi, Hui Fang, Chenxi Wang* "Investigation of Plasma Activation Directions for Low-damage Direct Bonding" ECS Journal of Solid State Science and Technology. 9, 081004. link

7. Qiushi Kang, Chenxi Wang*, Fanfan Niu, Shicheng Zhou, Jikai Xu, Yanhong Tian "Single-crystalline SiC Integrated onto Si-based Substrates via Plasma-activated Direct Bonding" Ceramics International. 46(14), 22718-22726. link

6. Chenxi Wang*, Hui Fang, Shicheng Zhou, Xiaoyun Qi, Fanfan Niu, Wei Zhang, Yanhong Tian, Suga Tadatomo "Recycled Low-temperature Direct Bonding of Si/glass and glass/glass Chips for Detachable Micro/nanofluidic Devices" Journal of Materials Science & Technology. 46, 156-167. link

5. Hui Fang, Chenxi Wang*, Shicheng Zhou, Qiushi Kang, Te Wang, Dongsheng Yang, Yanhong Tian, Suga Tadatomo "Rapid Pressureless and Low-temperature Bonding of Large-area Power Chips by Sintering Two-step Activated Ag Paste" Journal of Materials Science: Materials in Electronics, 31, 6497–6505. link

4. Hui Fang, Chenxi Wang*, Shicheng Zhou, Zhen Zheng, Tian Lu, Ge, Li, Yanhong Tian, Suga Tadatomo "Enhanced Adhesion and Anticorrosion of Silk Fibroin Coated Biodegradable Mg-Zn-Ca Alloy via a Two-step Plasma Activation" Corrosion Science, 108466. link

2019

3. Hui Fang, Chenxi Wang*, Te Wang, Hong Wang, Shicheng Zhou, Yilong Huang, Yanhong Tian
"Pressureless Low-temperature Sintering of Plasma Activated Ag Nanoparticles for High-power Device Packaging"
Materials Letters, 256, 126620. link

2. Boyan Huang, Chenxi Wang*, Hui Fang, Shicheng Zhou, Suga Tadatomo
"Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding"
Micromachines, 10(5), 339. link

1. Jikai Xu, Chenxi Wang*, Shicheng Zhou, Runbo Zhang, Yanhong Tian Y
"Low-temperature Direct Bonding of Si and Quartz Glass Using the APTES Modification"
Ceramics International, 45(13), 16670-16675. link

Conference Publications

(#: equal contribution *: corresponding author)

2023

10. Shicheng Zhou, Toshihiro Kasama, Ryo Miyake, Madoka Takai*, (2023, October). PLA/Au Microneedles-based Electrochemical Sensors for Interstitial Fluid Glucose Monitoring: Facile Fabrication and Superior Performance. In 2023 The 27th International Conference on Miniaturized Systems for Chemistry and Life Sciences, Actuators and Microsystems (μTAS 2023). CBMS.

9. Shicheng Zhou, Yutaro Chino, Toshihiro Kasama, Ryo Miyake, Takehiro Sato, Shigenobu Mitsuzawa, Madoka Takai*, (2023, June). Development of Hollow Typed Microneedles Patch with Continuous Glucose Monitoring Sensor Based on Polylactic Acid. In 2023 The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducer 2023). IEEE. (Oral Presentation)

2022

8. Shicheng Zhou, Takehiro Sato, Shigenobu Mitsuzawa, Yutaro Chino, Madoka Takai*, (2022, December). High-performance Redox Zwitterionic Hydrogel Platform towards Continuous Electrochemical Monitoring of Interstitial Fluid. In 2022 日本生理学研究会, 日本生理学研究所, 名古屋. (Oral Presentation)

2021

7. Xiaoyun Qi, Han Yan, Shicheng Zhou, Qiushi Kang, Chenxi Wang*, (2021, November). Moiré-Based Nanoprecision Bonding Alignment System for Hybrid Integration. In 2021 4th IEEE International Conference on Integrated Circuits (ICTA). IEEE.

2020

6. Shicheng Zhou, Xiaoyun Qi, Qiushi Kang, Chenxi Wang*. (2020, November). Low-temperature Direct and Indirect Bonding Using Plasma Activation for 3D Integration. In 2020 3rd IEEE International Conference on Integrated Circuits (ICTA) (pp. 132-134). IEEE.

5. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Tian Lu, Yanhong Tian. (2020, August). Low-temperature Bonding and Interfacial Failure Behavior of Si/glass and glass/glass chips. In 2020 21st International Conference on Electronic Packaging Technology (ICEPT). IEEE.

2019

4. 王晨曦*, 周诗承, 王特等. 基于等离子体表面活化的银纳米焊膏低温无压烧结工艺[C]. 第二十三次全国焊接会议, 机械工程学会, 2019.

3. Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Jikai Xu, Rong An, Yanhong Tian. (2019, August). Fabrication of SiC-on-insulator substrate via a low-temperature plasma activated bonding process. In 2019 20th International Conference on Electronic Packaging Technology (ICEPT) (pp. 1-4). IEEE.

2. Jikai Xu, Chenxi Wang*, Qiushi Kang, Shicheng Zhou, Yanhong Tian. (2019, May). Direct Heterogeneous Bonding of SiC to Si, SiO2, and Glass for High-Performance Power Electronics and Bio-MEMS. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 1266-1271). IEEE.

2018

1. Jikai Xu, Chenxi Wang*, Xiaoyun Qi, Bin Wu, Shicheng Zhou, Yanhong Tian. (2018, August). VUV/O3 Activated Bonder for Low-temperature Direct Bonding of Si-based Materials. In 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (pp. 1448-1452). IEEE.

Patents